NYCU Visit to Japan Boosts Semiconductor R&D and Celebrates University Merger

Kyushu University President Tatsuro Ishibashi (left) and NYCU President Chi-Hung Lin (right) signed a memorandum of understanding during a press conference on June 27 ©NYCU

As the global demand for semiconductors rises, Japan welcomes TSMC’s establishment and actively nurtures talent in this field. In late June, National Yang Ming Chiao Tung University (NYCU) visited Japan to enhance semiconductor research and development, and to partner with top Japanese universities.

Led by President Chi-Hung Lin, the NYCU delegation visited the Tokyo Institute of Technology, Hokkaido University, Tohoku University, Kyushu University, and Kumamoto University. During the visit, NYCU signed an MOU and agreements with Hokkaido University, Kumamoto University, and Kyushu University, aiming to promote the interaction through workshops and joint research to highlight the opportunities for collaboration in the semiconductor industry between Taiwan and Japan.

President Lin stated that the collaboration projects with Hokkaido University are intended to advance joint research in the semiconductor field, generate domestic value, and usher in a new era for the semiconductor industry while implementing credit recognition to further the development of the local semiconductor sector.

Hokkaido University plans to collaborate with NYCU on research integrating healthcare and semiconductors ©NYCU

Additionally, since September 2023, Kyushu University has collaborated with NYCU and the Industrial Technology Research Institute in semiconductors, smart vehicles, and green energy (Read More). During this visit, another MOU was signed to establish joint semiconductor research laboratories at Kyushu University’s Ito Campus and NYCU, enhancing industry-academia collaboration and aiding local companies in joining the international semiconductor supply chain.

Granting membership certificate ©NYCU

The visit also marked the announcement of the upcoming merger between Tokyo Institute of Technology (TIT) and Tokyo Medical and Dental University (TMDU) in October of this year. This move is expected to strengthen Japan’s research capabilities.

NYCU President Chi-Hung Lin led a delegation to Tokyo Institute of Technology to share the experience of the university merger ©NYCU

Tokyo Institute of Technology (TIT), NYCU’s sister university, founded in 1881, is one of Japan’s most prestigious universities for science and technology. The university boasts world-class research facilities and an outstanding faculty dedicated to cutting-edge research in scientific and technological fields. To foster deep collaboration in the semiconductor field, TIT annually offers a dual master’s degree program in partnership with the International College of Semiconductor Technology at NYCU.

Dr. Isao Satoh (front row, left) from Tokyo Institute of Technology and President Chi-Hung Lin from NYCU (front row, right) ©NYCU

After the merger, Dr. Naoto Ohtake will lead the new institution as its first president, according to TIT. President Lin congratulated the merger and expressed hopes for increased collaboration to provide students with a superior learning environment and abundant resources, jointly promoting technological innovation and talent cultivation (Read more).

NYCU’s visit to Japan significantly strengthened industry-academia ties and international cooperation in semiconductor technology, earning praise and extensive media coverage from outlets like Nikkei and NHK. This initiative marks a pivotal step in NYCU’s efforts to collaborate with Japan’s top universities to drive research advancements and contribute to global technological progress.